ARM9 embedded core-board Module EP9315
EP9315 ARM Processor Module Specifications
Core Module is designed by 6-floor PCB; the volume is only card size(88*55mm); together with CPU, SDRAM, NandFlash; 3.3V dc power supply, low power consumption; B to B(2*100)connectors lead various commonly used interfaces; suitable for the customers those who not plan to design CPU board by themselves next devolop.
EP9315 ARM Processor Module Specifications
CPU Processor
• CIRRUS LOGIC EP9315 processor, ARM920T core
• 200MHz
SDRAM Memory
• 64MB SDRAM, 2pcs * 4Banks * 4Mbitsx16bits SDRAM
FLASH Storage
• On-board 2-piece 16M*16bits NorFlash, 32M, could change a large capacity or industrial chip according to customer's requirement
Interfaces
• 2*100 pin 0.8mm spacing B to B(the connectors are 350°C high temperature-tested and seismic-tested)
PCB Specification & Size
• Using six floors of PCB high precision process, and has the best electrical properties and anti-jamming performance
• 88 x 55 x 1.5mm
Working Parameters
• Working temperature: -20°C~ 70°C (batch user could customize -40°C~ 85°C)
• Humidity Range: 5%~ 95%, Non-Condensing
Low Power Consumption
• 3.3V Dc power supply, low power consumption
Support OS
• Linux2.6.8 + QT2.3
• WindowsCE 5.0
EP9315 ARM Processor ModuleTechnical Support:
• The problems that customer encounter in the process of development on the products• System cut, according to customer's requirements
• Develop related drivers, according to the demand of customer(another pay)
• Customized development of back plane, according to customer's requirements(another pay)
Order Infomation
| Item | QY-9315P | ||
|---|---|---|---|
| DVD resources | Linux | Compilers | Cross-compiler arm-linux-gcc |
Tool software | Supporting terminal, writing, download tools | ||
| Device manual | Main components' datasheet of back plane | ||
User manual | About all development and use | ||
Image file | Redboot, kernal, image file of file system | ||
Test source code | Test routines and source codes of all interfaces | ||
| System source | Include Redboot, kernel, file system and QT source code | ||
| Schematic | Back plane's schematic in PDF format | ||
| Packaging library | Component packaging library of evaluation board | ||
| Windows CE | Tool software | Supporting terminal, writing, download tools, sync software | |
| Device manual | Main components' datasheet of back plane | ||
User manual | About all development and use | ||
Image file | Firstboot, Eboot, NK image file | ||
Test source code | Test routines and source codes of all interfaces | ||
| BSP package | Related BSP board-level supporting package | ||
| SDK | Related SDK | ||
Schematic | Back plane's schematic in PDF format | ||
Packaging library | Component packaging library of evaluation board | ||
| LCD options (another pay) | 4.3' LCD module + 4-wire resistive touch screen +USB cable | ||
| 5.6' LCD module + 4-wire resistive touch screen +USB cable | |||
| 6.4' LCD + 4-wire resistive touch screen + USB cable + inverter | |||
| 7' LCD module + 4-wire resistive touch screen +USB cable | |||
| 8' LCD module + 4-wire resistive touch screen +USB cable | |||
| 10.4' LCD + 4-wire resistive touch screen + USB cable + inverter | |||
| Module options(another pay) | TTL to LVDS module | ||
| TTL to VGA module | |||
| Sales hotline | +86-571-87858811, 87858822 | ||
EP9315 ARM9 embedded core-boardModule Application:
• Textile Industry, Numeric Control Industry, Automobile Electronics, Industrial Touch Screen Control System, Robot Vision, Media Deal Wireless Application, Digital Applicance, On-board Equipment, Communication Equipment, Network Terminal, etc.
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