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Help CenterSilicone Paste Thermal Conductivity Application in Electronic Parts and Chip Surface
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Silicone paste Thermal conductivity application in Electronic parts and chip surface
silicone heat sink compound thermal paste heavily filled with heat conductive metal oxides. The incorporation of high efficient heat-conductive metal oxides promotes high thermal conuctivity, low bleeding and high temperature stability.
Characteristics
1,Has excellent thermal conductivity
2. RoHS and REACH compliance.
Uses
This product is a better process performance, direct construction, construction method can smear brush, roller or screen printing. As the user to use silicone oil dilution, the phenomenon is not only easy to produce oil, but also the thermal conductivity decreases. Therefore, we recommend that customers first select a good model for their own, in order to ensure the use of quality products. Ⅰ, clean surface to be coated, remove oil. Ⅱ, then the thermal grease direct extrusion, uniform coating on the surface to be coated to step
Features
.Thermal conductivity: 2.0/3.0/5.0 W/M-K
. Low thermal resistance
. RoHS & UL compliance
Applications
. CPU and Chipset cooler
. Switching mode power
. Electronic Home compliance
. LED industry
. Others
Store Method:
. This item can be saved for 18 months when it is sealed under room temperature 25°C.
Physical Properties:
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