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Help Center10kg per Tank CPU and Chipset Cooler Conductive Silicone Paste
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10kg per tank CPU and Chipset cooler conductive silicone paste
G500 is a gray silicone heat sink compound thermal paste heavily filled with heat conductive metal oxides. The incorporation of high efficient heat-conductive metal oxides promotes high thermal conductivity, low bleeding and high temperature stability.
Characteristics
1,Has excellent thermal conductivity
2. RoHS and REACH compliance.
Uses
Mainly used in electronic components of the heat transfer medium, can enhance their work efficiency. Such as: high-power transistors (especially the plastic tube), SCR components, thermostat contacts between the diode and the substrate (aluminum, copper) contacts the heat transfer medium gap Department, rectifiers, radiator.
Features
.Thermal conductivity: 2.0/3.0/5.0 W/M-K
. Low thermal resistance
. RoHS & UL compliance
Applications
. CPU and Chipset cooler
. Switching mode power
. Electronic Home compliance
. LED industry
. Others
Store Method:
. This item can be saved for 18 months when it is sealed under room temperature 25°C.
Physical Properties:
PROPERTY |
G-200 |
G-300 |
G-500 |
TEST METHOD |
UNIT |
Density |
2.3 |
2.7 |
3.2 |
ASTM D792 |
--- |
Color |
Gray |
Gray |
Gray |
--- |
Visual |
Volatile Content |
0.5 |
0.3 |
0.2 |
ASTM E595 |
%/Wt |
Thermal Conductivity |
2.0 |
3.0 |
5.0 |
ASTM D5470 |
W/mK |
Thermal Resistance |
0.041 |
0.025 |
0.009 |
ASTM D5470 |
C-In2/W |
Breakdown Voltage |
1100 |
1000 |
600 |
ASTM D149 |
VAC/mil |
Dielectric Constant |
4.5 |
4.7 |
4.8 |
ASTM D150 |
--- |
Volume Voltage |
>1013 |
>1013 |
>1012 |
ASTM D257 |
--- |
Work Temp |
-50°C to 200°C |
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