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Help CenterThermal Grease for Cpu Highly Thermally Conductive Thermal Solution
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Thermal grease for cpu highly thermally conductive thermal solution
Benefits:
Conformable with very low compression forces
Will not cause corrosion on any metal surface
Introduction:
G500 is a highly conformable/thermally conductive, high viscosity type silicone compound. It provides a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices. G500 easily forms and adheres to most surfaces, shapes, and sizes of components.
Features
.Thermal conductivity: 2.0/3.0/5.0 W/M-K
. Low thermal resistance
. RoHS & UL compliance
Applications
. CPU and Chipset cooler
. Switching mode power
. Electronic Home compliance
. LED industry
. Others
Store Method:
. This item can be saved for 18 months when it is sealed under room temperature 25°C.
Physical Properties:
PROPERTY |
G-200 |
G-300 |
G-500 |
TEST METHOD |
UNIT |
Density |
2.3 |
2.7 |
3.2 |
ASTM D792 |
--- |
Color |
Gray |
Gray |
Gray |
--- |
Visual |
Volatile Content |
0.5 |
0.3 |
0.2 |
ASTM E595 |
%/Wt |
Thermal Conductivity |
2.0 |
3.0 |
5.0 |
ASTM D5470 |
W/mK |
Thermal Resistance |
0.041 |
0.025 |
0.009 |
ASTM D5470 |
C-In2/W |
Breakdown Voltage |
1100 |
1000 |
600 |
ASTM D149 |
VAC/mil |
Dielectric Constant |
4.5 |
4.7 |
4.8 |
ASTM D150 |
--- |
Volume Voltage |
>1013 |
>1013 |
>1012 |
ASTM D257 |
--- |
Work Temp |
-50°C to 200°C |
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