MOKO BLE device bluetooth circuit board bluetooth module

Layer

1,2,4 or 6,upto 18 layers

Material

FR4,CEM1,CEM3,Hight TG,FR4 Halogen Free,FR1,FR2

Order Quantity

1-500,000

Board shape 

Rectangular,round,slots,cutouts,complex,irregular

Board type

Rigid,flexible,rigid-flexible

Board material

FR-4,glass epoxy,FR4 High Tg,Rohs compliant,Aluminum,Rogers,etc

Board cutting

Shear,V-score,tab-routed

Board thickness

0.2~4.0mm,Flex 0.01~0.25''

Copper weight

1.0,1.5,2.0oz

Solder mask 

Double-sided green LPI,Also support red,white,yellow,blue,black

Silk screen

Double-sided or single-sided in white,yellow,black,or negative

Silk screen min line width

0.006'' or 0.15mm

Max board dimensions

20inch*20inch or 500mm*500mm

Min drill hole diameter

0.01'',0.25mm.or 10 mils

Surface finish

HASL,Nickle,Imm Gold,Imm Tin,Imm Silver,OSP etc

Board thickness tolerance

± 10%

Copper weight tolerance

± 0.25oz

Minimal slot width

0.12'',3.0mm,or 120mils

V-score depth

20-25% of board thickness

Plated through holes

Yes

Sink holes

Yes

Design file format

Gerber RS-274X,274D,Eagle and AutoCAD'S DXF,DWG

Single,Double sided

Four layer

Six layer

Above eight layer

HDI

Sample lead time(Normal)

5-6

6-7

7-8

10-12

15-20

Sample lead time(Fastest)

48 to 72 hours

5

6

6-7

12

Mass production 

lead time(First batch)

7-9

10-12

13-15

16

20

PCB Assembly

PCB Fab+Components Sourcing+PCBA=15 days