CTP Plate (computer to plate, printing plate)

Specifications

US ADS tech,
Independent Patent to produce aluminum matrix
Achieving 1-99% microdot reproduction for CTP plate.

Thermal CTP (Computer to Plate) plate    0.28mm thickness

No preheating, positive thermal plate with wide operation lititude for medium run sheetfed, weboffset and packaging applications. 140P can be baked for over 1 million impressions and UV ink applications.

 

Technical Specification:

Plate: Electrochemically grained and anodized aluminum substrate with blue coating.

Produced under patents: US6, 124, 425, US6, 177 and 182

EP11614469 and other patents pending

Gauge: 0.2mm, 0.3mm, 0.4mm and 0.5mm

Spectra Sensitivity: 800-850mm

Plate setter compatibility: Any suitable thermal platesetters available from Agfa, Kodak, Heidelberg, Screen and Presstek

Laser energy Required: 140-160mj/cm2

Resolution: 1% to 99% @ 250 lpi

FM capability: 20 m stochastic

Processors: Any suitable processors for positive thermal plates and to Kodak

Developer: Recommended to use 140D positive plate developer

Plate finisher: Recommended to use 140G plate finisher

Processing: Developer temperature 22 to 23C

Dwell time: 30+/- 1 seconds

Replenishment rate 110ml/m2

Baking conditions: Apply 140B Baj/king Gum before baking

-Static oven: 220-230C for a duration of 3-5 minutes

-Online oven: 240C for a duration of 4 minutes

Run Length: 100,000 impressions unbaked, 1 million impressions baked actual run length may vary according to press, ink and paper conditions

Safelight: Daylight handling

Shelf life: 12 months under recommended strorage conditions

Transport and storage: Store plates flat in their packaging at a temperature between 15 and 25C with relative humidity between 40 and 70%

 

Our factory obtained GB/T 19001-2000-ISO9001; 2000 certification on Nov. 26, 2007, and Shanghai enterprices standard Q/VCHD01-2007 is strictly followed throughout the process of production and operating.