PCBA Assembly
Specifications
1.PCB design and assembly2.Engineering service
3.UL.CE.FCC.Rohs approval
4.Various size
5.1-12layer
PCBA Serive.
Technique requirement:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
| Multi-layer PCB Specification | ||
| providing you one-stop pcb assemblies service. | ||
| 1 | Layer | 1-12 layer |
| 2 | Material | FR-1,FR-2,FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free, |
| 3 | Board thickness | 0.2mm-3.5mm |
| 4 | Max panel size | 630mm*520mm |
| 5 | Min.drilled hole size | 0.5mm |
| 6 | Min.line width | 0.075mm(3mil) |
| 7 | Min.line spaceing | 0.075mm(3mil) |
| 8 | Surface finish/treatment | HASL/HASL lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating |
| 9 | Copper thickness | 0.5oz Min.,5.0oz Max |
| 10 | Solder mask color | green/black/white/red/blue/yellow |
| 11 | Inner packing | Vaccum packing,Plastic bag |
| 12 | Outer packing | standard carton paking |
| 13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| 14 | Certificate | UL,ISO9001,ISO14001,ISO/TS16949,ROHS |
| 15 | profiling punching | Routing,V-CUT,Beveling |
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