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Help CenterEpoxy Copper Clad Laminated Sheet for PCB
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I.Application:
Computer:
Communication device;
Measuring instrument;
Video;
TV;
Player,etc.
II.Standard dimension
THICKNESS |
COPPER FOIL |
SIZE |
THICKNESS TOLERANCE |
|||
Inch |
mm |
oz(μm) |
Inch |
mm |
||
0.002 |
0.05 |
1/3(12) 1/2(17) |
36×48 &37×51 |
915×1220 &940×1300 |
IPC-4101C C/M |
|
To |
1.0(35) 2.0(70) |
40×48 &41×51 |
1020×1220 &1040×1300 |
|||
0.125 |
3.2 |
3.0(103) |
42×48 &42.5×51 |
1070×1220 &1080×1300 |
||
Notes:Special dimension according to cutomer's requirements.
III.Performance List for HRFR-4UV
HRFR-4 Laminate |
Unit |
specification |
Typical Value |
Test |
|
Metric |
<0.5mm |
≥0.5mm |
1.6mm CCL |
IPC-TM-650 |
|
1. Peel Strength,as received |
N/mm |
|
1.80 |
--- |
|
A. 17micron copper |
≥0.79 |
≥1.05 |
|||
B. 35micron copper |
≥1.05 |
≥1.40 |
|||
C. 70micron copper |
≥1.40 |
≥1.93 |
|||
D. 105,140,175micron copper and above |
≥1.58 |
≥2.10 |
|||
2. Surface resistivity |
MΩ |
|
--- 5.4×107 5.6×106 |
||
A. Constant temp.&moisture C-96/35/90 |
≥104 |
--- |
|||
B. After moisture resistance |
--- |
≥104 |
|||
C. Under high temperature |
≥103 |
≥103 |
|||
3. Volume resistivity |
MΩ.cm |
--- 5.4×108 5.6×106 |
|||
A. Constant temp.&moisture C-96/35/90 |
≥106 |
--- |
|||
B. After moisture resistance |
--- |
≥104 |
|||
C. Under high temperature |
≥103 |
≥103 |
|||
4. Moisture absorption |
% |
--- |
≤0.80 |
0.15 |
|
5. Dielectric breakdown |
KV |
--- |
40 |
50 |
|
6. Permittivity at 1MHZ |
-- |
<5.4 |
<5.4 |
4.6 |
|
7. Tg(DSC) |
°C |
--- |
≥130 |
138 |
|
8. Loss tangent at 1MHZ |
-- |
<0.035 |
<0.035 |
0.015 |
|
9. Pressure Vessel Method |
260°C/20S |
pass |
pass |
pass |
|
pass |
pass |
pass |
|||
10. Thermal stress |
288°C/20S |
||||
Non etching |
pass |
pass |
pass |
||
Etch |
pass |
pass |
pass |
||
11. Flammability |
Rating |
94V-0 |
94V-0 |
94V-0 |
|
12. Dimensional stability |
ppm |
--- |
±300 |
±180 |
|
IV.Details;
Send Inquiry to This Supplier
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