FR-4UV Copper Cladding Laminate Sheet for PCB
Specifications
1.FR-4UV copper clad laminate sheet2.Apply to fead free procesing
3.Certificate:UL,VDE,SGS,TS1
FR-4UV copper clad laminate sheet
Application:
Widely used in high speed computer,communication device,radar,electronic components of microwave strip line,etc.
Standard dimension
Thickness |
Copper foil |
Dimension |
||
mil |
mm |
oz(μm) |
inch |
mm |
8 |
0.2 |
1/3(12) 1/2(17) 1.0(35) 2.0(70) 3.0(103) |
36×48 & 37×51 |
915×1220 & 940×1300 |
to |
40×48 & 41×51 |
1020×1220 & 1040×1300 |
||
125 |
3.2 |
42×48 & 42.5×51 |
1070×1220 & 1080×1300 |
|
Note:Special requirements should be discussed by sellers and buyers
Specifications:
HR-4150LD Laminate |
Unit |
specification |
Typical Value |
Test Method |
|
Metric |
<0.5mm |
≥0.5mm |
1.6mm CCL |
IPC-TM-650 |
|
1. Peel Strength,as received. |
N/mm |
|
|
1.62 |
--- |
A. 17micron copper |
≥0.70 |
≥0.7 |
|||
B. 35micron copper |
≥0.79 |
≥1.05 |
|||
C. 70micron copper |
≥0.88 |
≥1.40 |
|||
D. 105,140,175micron copper and above |
≥0.96 |
≥1.58 |
|||
2. Surface resistivity |
MΩ |
|
|
|
|
A. Constant temp.& moisture C-96/35/90 |
≥106 |
--- |
--- |
||
B. After moisture resistance |
--- |
≥104 |
5.6×107 |
||
C. After high temperature |
≥103 |
≥103 |
4.7×106 |
||
3. Volume resistivity |
MΩ.cm |
|
|||
A. Constant temp.&moisture C-96/35/90 |
≥106 |
--- |
--- |
||
B. After moisture resistance |
--- |
≥107 |
4.2×108 |
||
C. Under high temperature |
≥103 |
≥103 |
3.5×106 |
||
4. Moisture absorption |
% |
--- |
≤0.5 |
0.18 |
|
5. Dielectric breakdown |
KV |
--- |
40 |
53 |
|
6. Permittivity at 1MHZ |
-- |
<5.4 |
<5.4 |
3.3 |
|
7. Tg(DSC) |
°C |
--- |
--- |
256 |
|
8. Loss tangent at 1MHZ |
-- |
<0.035 |
<0.035 |
0.003 |
|
9. Thermal stress |
288°C/20S |
|
|
|
|
Non-etching |
pass |
pass |
110s pass |
||
Etch |
pass |
pass |
110s pass |
||
10. Flammability |
Rating |
94V-0 |
94V-0 |
94V-0 |
|
|
11. Flexural strength of laminate Length direction |
N/mm2 |
|
|
|
|
--- |
≥415 |
520 |
|||
Cross direction |
--- |
≥345 |
410 |
||
12. Glass Transition Temperature |
°C |
--- |
≥340 |
350(TDloss5%) |
|
13. Heat resistance(without copper foil |
|
|
|
|
|
Thermal Resistance(Copper removed) |
|
|
|
|
|
A,T-260 |
Min |
--- |
≥30 |
60 |
|
B,T-288 |
Min |
--- |
≥5 |
5 |
|
FAQ
Q: 1. Can I have free samples?
A: Yes, we can provide free sample only for small size after you accept our price and all the information confirmed by you.
Q: 2. What is the manufacturing time?
A:Sample needs 1-3 days, mass production needs 10-15 days, It depends on quantity.
Q: 3. What is your MOQ?
A: Our MOQ is 500 sheets for copper clad laminate,and 2 rolls of prepreg
Q: 4. Can you accept mixed batch of different products?
A: Yes, we are support different product mix wholesale.
Q: 5. How do you ship the goods ?
A: For huge quantity,we can deliver it by FCL,for small quantity,we can deliver by LCL,samples willdeliver by express.
Any other question,pls feel free to leave a message.We are looking for your inquiry!
Send Inquiry to This Supplier
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