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Help CenterCEM-1 Fiberglass Copper Clad Laminate Sheet
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Specifications
1.CEM-1 fiberglass copper clad laminate sheet2.Excellent punching&machining property
3.IPC-4101C specification
CEM-1 fiberglass copper clad laminate sheet
Application:
HR1130 laminate sheet widely used in
monitor,
power supply,
keyboard,
game machine,etc.
Standard size
Base Color |
Thickness |
Copper Clad |
Regular Size |
Thickness |
|
white yellow |
0.8~1.6mm |
H oz(18μm) 1oz (35μm) 2oz (70μm) |
915×1220mm(36″×48″)1020×1220mm(40″×48″) 1070×1220mm(42″×48″) |
IPC4101C C/M |
Desciption:
HR-1130 Laminate |
Unit |
specification |
Typical Value |
Test Method |
|
Metric |
<0.5mm |
≥0.5mm |
1.6mm CCL |
IPC-TM-650 |
|
1. Peel Strength,as received. |
N/mm |
1.8 |
--- |
||
A. 17micron copper |
≥1.05 |
≥1.05 |
|||
B. 35micron copper |
≥1.4 |
≥1.4 |
|||
C. 70micron copper |
|
|
|||
D. 105,140,175micron copper and above |
|
|
|||
2. Surface resistivity |
MΩ |
||||
A. Constant temp.&moisture C-96/35/90 |
≥103 |
--- |
--- |
||
B. After moisture resistance |
--- |
≥103 |
2.7×106 |
||
C. Under high temperature |
≥103 |
≥103 |
--- |
||
3. Volume resistivity |
MΩ.cm |
||||
A. Constant temp.&moisture C-96/35/90 |
≥103 |
--- |
--- |
||
B. After moisture resistance |
--- |
≥103 |
2.9×106 |
||
C. Under high temperature |
≥103 |
≥103 |
--- |
||
4. Moisture absorption |
% |
--- |
≤0.80 |
0.11 |
|
5. Dielectric breakdown |
KV |
--- |
40 |
45 |
|
6. Permittivity at 1MHZ |
-- |
<5.4 |
<5.4 |
4.6 |
|
7. Tg(DSC) |
°C |
--- |
--- |
110 |
|
8. Loss tangent at 1MHZ |
-- |
<0.035 |
<0.035 |
0.026 |
|
9. Thermal stress |
260°C/10S |
||||
Non-etching |
pass |
pass |
pass |
||
Etch |
pass |
pass |
pass |
||
10. Flammability |
Rating |
94V-0 |
94V-0 |
94V-0 |
|
11. Flexural strength of laminate |
N/mm2 |
||||
Length direction |
--- |
≥242 |
410 |
||
Cross direction |
--- |
≥172 |
280 |
||
Details:
Send Inquiry to This Supplier
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