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Specifications
1.Metal base copper clad laminate sheet manufacturer2.Excellent electromagnetic shielding,machinability
3.Perfect machinabilt
Metal base copper clad laminate sheet manufacturer
Structure:
Circuit layer----Made of compressed electrolytic copper foil
Insulating layer----Plexiglass,inorganic glass
Metal base----Aluminum plate,copper plate
Standard dimension:
Kind |
Type |
Heat conductivity (W/m.k) |
Thickness of insulating layer(um) |
Standard dimension(mm) |
Thickness of copper foil(OZ) |
Thickness of AL plate(mm) |
AL type |
AL base ccl |
HR 5100 |
1.0 |
60-200 |
1000x1200(Customized) |
1oz~6oz |
0.2mm~3.2mm |
1060 5052 6061 |
HR 5110 |
2.0 |
60-200 |
HR-5100:(1W series)Normal Heat-transfer performance
Target item |
Treatment condition |
Unit |
Value |
Testing results |
Heat conductivity |
A |
W/m·K |
≥ 1.0 |
1.18 |
Flammability |
E-24/125 |
------ |
V-0 |
V-0 |
Volume resistivity |
E24/125 |
MΩ·cm |
≥103 |
2.3×108 |
Surface resistivity |
E24/125 |
MΩ |
≥103 |
5.6×105 |
Dielectric breakdown |
D-48/50 D-0.5/23 |
KV/AC |
≥2 |
4.2 |
Peel Strength |
A |
N/mm |
≥1.05 |
1.60 |
Thermal stress |
288°C,tin dipping |
- |
≥30S(no delamination) |
133S |
Moisture absorption |
D-24/23 |
% |
≤0.80 |
0.11 |
HR-5110:(2W series)Super High Heat-transfer performance
Target item |
Treatment condition |
Unit |
Value |
Testing results |
Heat conductivity |
A |
W/m·K |
≥2.0 |
2.1 |
Flammability |
E-24/125 |
------ |
V-0 |
V-0 |
Volume resistivity |
E24/125 |
MΩ·cm |
≥103 |
1.7×108 |
Surface resistivity |
E24/125 |
MΩ |
≥103 |
8.9×105 |
Dielectric breakdown |
D-48/50 D-0.5/23 |
KV/AC |
≥2 |
4.3 |
Peel Strength |
A |
N/mm |
≥1.05 |
1.53 |
Thermal stress |
288°C,tin dipping |
- |
≥30S(no delamination) |
244S |
Moisture absorption |
D-24/23 |
% |
≤0.80 |
0.13 |
Details:
Send Inquiry to This Supplier
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