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Help CenterOne-stop Pcb Making,components Sourcing and Pcb Assembly Manufacturing
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one-stop pcb making,components sourcing and pcb assembly manufacturing
PCB Material |
FR4 |
| PCB Layer | 2 |
| PCB Thickness | 1.6mm |
| Copper Thickness | 1OZ |
| Surface treatment | ENIG |
| Soldermask | Green |
| Silkscreen | White |
About Fulltronics
Type of facility: Manufacturing
Facility Size: 110,000 sq meter
Total Number of Employees: 400-500
Total Production: 20,000-30,000 sq m./month
Top three Major Customer: America,Euerope,Africa
Estimated Annual Sales: around 8 million
Work days: Monday - Friday, 9am to 6pm
Our boards Applications
We currently have customers in the defence, medical/pharmaceutical, automotive, industrial control, consumer electronics, agricultural, marine, recreational, petroleum and telecommunications industries.
PCB Capacity Sheet:
| Item | Mass Production | Pilot Run Production |
| Capacity | Capacity | |
| Layer Counts | 1L—18L, HDI | 20-28 , HDI |
| Material | CME1,CME3,FR-4, High TG FR4 , Halogen-free FR4 , aluminium ,Ceramic(96% Alumina) | |
| Teflon,PTFE(F4B,F4BK), Rogers(4003,4350,5880) Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc. | ||
| Material Mixed Laminate | 4 layers -- 10 layers | 12 layers |
| FR4+Ro4350 , FR4+Aluminium , FR4+ FPC | ||
| Maximum Size | 610mm X 1200mm | 1200 - 2000MM |
| Board Outline Tolerance | ±0.15mm | ±0.10mm |
| Board Thickness | 0.125mm--6.00mm | 0.1mm--8.00mm |
| Thickness Tolerance ( t≥0.8mm) | ± 8% | ±5% |
| Thickness Tolerance( t<0.8mm) | ±10% | ±8% |
| Minimum Line / Space | 0.10mm | 0.075mm |
| Trace width Tolerance | 15%-20% | 10% |
| Minimum Drilling Hole (Mechanical) | 0.2mm | 0.15mm |
| Minimum laser hole | 0.1mm | 0.075mm |
| Hole Position/hole Tolerance | ±0.05mm PTH:±0.076MM NPTH:±0.05mm | |
| Mini hole ring (single | 0.075MM | 0.05MM |
| OutLayer Copper Thickness | 17um--175um | 175um--210um |
| InnerLayer Copper Thickness | 17um--175um | 175um--210um |
| Mini Solder Mask Bridge | 0.05mm | 0.025mm |
| Impedance Control Tolerance | ±10% | ±5% |
| Surface Finishing | HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver. | |
| Plated gold , OSP, Carbon ink, | ||
| 1-2L Lead-time | 3-7 days | 1-2 days |
| 4- 8L Lead-time | 7-10 days | 2-7 days |
| 10-18L Lead-time | 10-15 days | 4-9 days |
| 20-28L Lead-time | 15-20 days | |
| Acceptable File Format | ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc. | |
| Quality Standards | IPC-A-600F and MIL-STD-105D CHINA GB<4588> | |
Our PCBA Competence:
|
PCB assembly Facility
| |||||
| Equipment | Process | Brand | Model | Qty | Setup Time |
| High Speed SMT Machine | SMT | FUJI | CP6 | 1 | 2007 |
| FUJI | CP643 | 3 | 2008 | ||
| Multifunctional SMT Machine | SAMSUNG | 321 | 2 | 2009 | |
| SAMSUNG | 421 | 2 | 2009 | ||
| YAMAHA | YV100 | 2 | 2007 | ||
| Automatic Printing Machine | 6 | 2007 | |||
| Reflow Soldering(Leeded) | NOUSSTAR | 2 | 2007 | ||
| Reflow Soldering(Lead free) | 2 | 2007 | |||
| DIP line(Leeded) | DIP | 1 | 2007 | ||
| DIP line(Lead free) | 2 | 2008 | |||
| Wave Soldering(Leeded) | NITTO | 2 | 2007 | ||
| Wave Soldering(Leed free) | 2 | 2009 | |||
| Production assembly line | Assembly | 5 | 2007 | ||
| Functional Testing line | 2 | 2007 | |||
| PCBA repair line | 2 | 2007 | |||
| Automatic Optic Inspection | Test | ZHENGHUAXIN | VCTA-A410 | 2 | 2010 |
| ITEM | TECHNICAL PARAMETER | ||||
| Stencil size/range: | 736x736mm | ||||
| Minimum IC pitch: | 0.30mm | ||||
| Maximum PCB size: | 1200x 500mm | ||||
| Minimum PCB thickness: | 0.35mm | ||||
| Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) | ||||
| Maximum BGA size: | 74x74mm | ||||
| BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) | ||||
| BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) | ||||
| QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) | ||||
| Frequency of stencil cleaning: | 1 time/5 to 10 pieces | ||||
Testing
AOI Testing
- Checks for solder paste
- Checks for components down to 0201"
- Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
- BGAs
- Micro BGAs
- Chip scale packages
- Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.
- Power-up Test
- Advanced Function Test
- Flash Device Programming
- Functional testing
1.Are my design files secure when I send them to you?
Your files are held in complete safety and security.Your files are never shared nor will any third parties have access to your design files.Fulltronics can sign an NDA(Non-disclosure agreement) before sending files.
2.For small quantity orders, can you produce prototype PCBs?
Yes. Fulltronics can produce prototypes. but the greater the quantity, the greater the cost savings.
3.What file formats do you accept for PCB and assembly?
Gerber ,CAM Auto CAD DXF, DWG formats.
4.For pcb copy,if I send the sample to you,will it get destroyed?
As we need to take every component down to analysis,so the board will be destroyed,normally we suggest customer to offer 2 samples.
5.Do you have after-sales product servicing available for your customers?
Yes,for any quality problems Fulltronics will take our responsibility to solve it for you any time.
© copyright Fulltronics Corporation Limited Tel:86-755-83975258 Email:cathy at
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