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12layers Multilayer Pcb Board, High-density Pcb Board

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US$ 1 - 2 MOQ: 5 Pieces
Key Specifications
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Place of Origin:
Guangdong, China
Model Number:
FCPCB0033
Number of Layers:
12-Layer
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Shenzhen Fulltronics Technology Co., Ltd.
Payment & Shipping
Payment Methods:
Port of Shipment:
shenzhen/hk
Delivery Detail:
Delivery time depends on order quantity.

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Place of Origin Guangdong, China
Model Number FCPCB0033
Number of Layers 12-Layer
Base Material FR4
Copper Thickness 1OZ
Board Thickness 1.6mm
Min. Hole Size 0.1mm
Min. Line Width 4mil
Min. Line Spacing 4mil
Surface Finishing immersion gold

Specifications

12 layers Fr4 pcb board
Minimum order quantity: 5piece
Supply Ability: 30000 Square Meters per Month
UL, ISO9001,ISO14000 ,RO

Your Best Choice for Printed Circuit Board Manufacturing & Assembly

 

 

OEM/ODM/EMS Services for PCBA:

  • PCBA, PCB Board assembly: SMT & PTH & BGA
  • PCBA and enclosure design
  • Components sourcing and purchasing
  • Quick prototyping
  • Plastic injection molding
  • Metal sheet stamping
  • Final assembly
  • Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
  • Custom clearance for material importing and product exporting

Capability - SMT

  • Lines                   9(5 Yamaha,4KME)
  • Capacity                 52 million placements per month
  • Max Board Size           457*356mm.(18”X14”)
  • Min Component size       0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP
  • Speed                   0.15 sec/chip,0.7 sec/QFP

Capability - PTH

  • Lines                   2
  • Max board width         400 mm
  • Type                   Dual wave
  • Pbs status               Lead-free line support
  • Max temp               399 degree C
  • Spray flux               add-on
  • Pre-heat                 3

Technical Data:

 

Stencil size/range:

736x736mm

Minimum IC pitch:

0.30mm

Maximum PCB size:

1200x 500mm

Minimum PCB thickness:

0.35mm

Minimum chip size:

0201 (0.2x0.1)/0603 (0.6 x 0.3mm)

Maximum BGA size:

74x74mm

BGA ball pitch:

1.00mm (minimum), 3.00mm (maximum)

BGA ball diameter:

0.40mm (minimum), 1.00mm (maximum)

QFP lead pitch:

0.38mm (minimum), 2.54mm (maximum)

Frequency of stencil cleaning:

1 time/5 to 10 pieces

 

Turn Times:

Quick turn are our Specialty

Volume:

One piece to low valume production quantityes

Low cost first article builds

Schedule deliveries

Assembly type:

Surface mount(SMT) assembly

Thru-hole

Mixed(surface mount and thu-hole) technology

Single or double sided placement

Cable assembly

Components type:

Passive components:

As small as 0402 package

As small as 0201 with design review

Ball Grid Arrays(BGA):

As small as .5mm pitch

 

Stencil:

Laser cut stainless steel

Parts procurements:

Turnkey(we supply the parts)

Consigned(you supply the parts)

You supply some parts, we do the rest

Solder type:

Leaded

Lead-free/ROHS compliant

Other capabilities:

Repair/rework services

Mechanical assembly

Box build/electromechanical assembly

Mould and plastic injection.

 

 

12layers multilayer pcb board, high-density pcb board 

 

AOI Testing

  • Checks for solder paste
  • Checks for components down to 0201"
  • Checks for missing components, offset, incorrect parts, polarity

 

X-Ray Inspection

X-Ray provides high-resolution inspection of:

  • BGAs
  • Micro BGAs
  • Chip scale packages
  • Bare boards

 

In-Circuit Testing

In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.

  • Power-up Test
  • Advanced Function Test
  • Flash Device Programming
  • Functional testing

 

Our partners:

12layers multilayer pcb board, high-density pcb board

Applications:

Defence, broadcasting,medical,telecommunication systems,industrial control, traffic intelligence systems, auto industry, agriculture and so on.

12layers multilayer pcb board, high-density pcb board

 

About Fulltronics:

 

Our service: Design/Layout of Printed Circuit Boards, PCB Fabrication, Component Assembly, Wire Harness Assembly, Box Assembly, Parts Procurement, Component Forming and Electrical Testing.

We are certified with: ISO9001 & ts16949, UL Certification and ROSH if required.

 

Why choose us? 

We purchase material from Original Company and distributers.

We make products by strict engineer processes.

We have strict inspection processes.

We send products by vaccum package,antistatic package and carton box.

 

Quote Requirements for PCB and PCB Assembly:

- Gerber File and Bom List;
- Quantity;
- Technical requirements for quoting reference;
- Clear pictures of PCB or PCB Assembly sample if avaliable.
- Inspection method for PCB Assembly. 

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Shenzhen Fulltronics Technology Co., Ltd.
Business Type
Manufacturer, Distributor/Wholesaler
Year Established
2012
Factory Size
Below 1,000 square meters
Total Employees
301 - 500 People
Contact Supplier Request Quote Chat Now

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