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NEW AMD E-350 EME350GBB22GT Notebook Due Core 413-ball Lidless Micro-BGA CPU Microprocessor

NEW AMD E-350 EME350GBB22GT Notebook Due Core 413-ball Lidless Micro-BGA CPU Microprocessor photo-1
Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)
Key Specifications
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Products Status:
Stock
Application:
Laptop
Processor Brand:
AMD
Payment & Shipping
Payment Methods:
Port of Shipment:
HK
Delivery Detail:
Delivery time depends on order quantity.
Products Status Stock
Application Laptop
Processor Brand AMD
Type Dual-Core
Processor Type AMD Athlon
L2 Cache Other, ≤ 1MB
Socket Type Other, 413-ball lidless micro-BGA
Main Frequency 1600 MHz
Brand Name AMD
Model Number E-350
Place of Origin United States

Specifications

NEW AMD E-350 EME350GBB22GT Notebook Due Core CPU Microprocessor 413-ball lidless micro-BGA

 

NEW AMD E-350 EME350GBB22GT Notebook Due Core CPU Microprocessor 413-ball lidless micro-BGA

 

 

NEW AMD E-350 EME350GBB22GT Notebook Due Core 413-ball lidless micro-BGA CPU MicroprocessorNEW AMD E-350 EME350GBB22GT Notebook Due Core 413-ball lidless micro-BGA CPU Microprocessor

 

 

Package & Delivery &Payment & Warranty

Package TRAY
Delivery : FOB HK/EXW HK

 

NEW AMD E-350 EME350GBB22GT


General information
Type CPU / Microprocessor
Market segment Mobile
Family AMD E-Series
Model number  ?  E-350
CPU part number EME350GBB22GT is an OEM/tray microprocessor
Frequency  ?  1600 MHz
Clock multiplier  ?  8
Package 413-ball lidless micro-BGA (FT1)
Socket BGA413
Size 0.75" x 0.75" / 1.9cm x 1.9cm
Introduction date Jan 4, 2011
 
Architecture / Microarchitecture
Microarchitecture Bobcat
Platform Brazos
Processor core  ?  Zacate
Core stepping  ?  B0
CPUID 500F10
Manufacturing process 0.04 micron
Data width 64 bit
The number of cores 2
The number of threads 2
Floating Point Unit Integrated
Level 1 cache size  ?  2 x 32 KB 2-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size  ?  2 x 512 KB 16-way associative caches
Pipeline 15-stage
Multiprocessing Uniprocessor
Features
  • MMX technology
  • SSE
  • SSE2
  • SSE3
  • Supplemental SSE3
  • SSE4a  ? 
  • AMD64 technology  ? 
  • Enhanced Virus Protection  ? 
  • Virtualization technology  ? 
Low power features
  • Core C1 and C6 states
  • Package C1 and C6 states
  • PowerNow!
On-chip peripherals
  • 64-bit DDR3 memory controller
  • Graphics processing unit with 80 shader cores
  • PCI Express
 
Electrical/Thermal parameters
V core  ?  1.25V - 1.35V
Maximum operating temperature  ?  90°C
Thermal Design Power  ?  18 Watt

 

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Business Type
Trading Company
Year Established
2005
Factory Size
Below 1,000 square meters
Total Employees
11 - 50 People