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Home > Industrial Equipment & Components > Welding & Soldering Supplies > Other Welding & Soldering Supplies > Press Fit Fixtures/Wave Solder Pallets/smt Tooling

Press Fit Fixtures/Wave Solder Pallets/smt Tooling

Name: Press Fit Fixtures/Wave Solder Pallets/smt Tooling
Brand: Chuangwei smt tooling
SKU: 102494703
Availability: InStock

Dongguan Chuangwei Electronic Equipment Manufactory

Press Fit Fixtures/Wave Solder Pallets/smt Tooling thumbnail-1

Press Fit Fixtures/Wave Solder Pallets/smt Tooling photo-1

US$ 1 - 60 MOQ: 1 Set

Key Specifications

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Place of Origin:

Guangdong, China

Brand Name:

Chuangwei smt tooling

Model Number:

CWZJ-27

Contact Supplier Request Quote Chat Now

Payment & Shipping

Payment Methods:

Port of Shipment:

shenzhen / hongkong

Delivery Detail:

Delivery time depends on order quantity.

Product Details
Company Profile
Contact Us

Place of Origin Guangdong, China

Brand Name Chuangwei smt tooling

Model Number CWZJ-27

Press fit Fixtures/Wave solder pallets/smt tooling

Wave solder carriers offer many advantages to the cost conscious Process Engineer. These advantages can usually pay back in a few weeks with cost savings and improved yields. By deploying a double reflow process, you can maximize your yields through the wave solder process.

Other advantages are:

Eliminate flooding by masking open areas and preventing board sag.
Reduce second hand load parts and hand soldering.
Save thousands of dollars in Kapton tape and the labor to add and remove.
The composite materials thermally protect bottom side SMD’s from shock.
Mask BGA vias from the wave ensuring reliable solder joints.
Lead Free grade optical material for higher temperatures

Reflow Tin Furnace Jig SMT Pallets / PCB Carrier With High Standard Durostone

Surface Mount Process Carriers are engineered to completely fixture a circuit board during the overall assembly process. These carriers are made of high-temperature semi-conductive composite materials, used from start to finish in the assembly process.

Surface Mount Process Carriers have many features and benefits which enhance automated assembly and increase production by:

1. Reducing set-up time.
2. Eliminating unnecessary PCB board handling by operators.
3. Minimizing board warping.
4. Eliminate expensive hand masking and labour costs.
5. Standardizing process repetition.
6. Machine parameters.
7. Minimizing soldering defects.

Surface Mount Process Carriers are made of composite materials with advantageous features such as:

1. High-temperature compatibility to endure repeated cycles through the re-flow.
2. Material stability to ensure board alignment is consistent.
3. Chemical resistance for increased durability through harsh cleaning process.

Specification for Press fit Fixtures :

Model	DurostoneCHP760	DurostoneCAS761	DurostoneCAG762
Grade	Standard	Anti-Static	Anti-static(Optical)
Colour	Blue	Black	Grey
Density(g/mm3)	1.85	1.85	1.85
Standard OperationTemperature	260	260	260
Maximum Operation Temperature(C)	350	350	350
Sheet Size(mm)	2440×1220	2440×1220	2440×1220
Tickness/weight(mm/kg)	3/17, 4/22	5/28, 6/33, 8/44	10/55, 12/66

This estimation may be done in three ways

If a PCB is available (preferably populated) - our sales engineers can rapidly evaluate your board.
If PCB design data is available we will process, analyse and remotely assess it.
You can do it using the rules presented below - our customers quickly find that the above two methods are easiest.

Gerber, Excellon and other data required

Pin Land to SMT pad clearance evaluation

The two figures below each show part of a CSWSC in plan and section views. The right hand figure shows that more clearance
is required when the connector orientation is perpendicular to the wave.

Company information :

We are often called upon by our customers to help with identifying design respin opportunities.

We will identify problem areas within a board and suggest appropriate movements of components. (Ideally before the PCB is fabricated)

However for board designers reading this, can you remember another four "rules" (to compete with the hundred other rules you have to have floating
around in your head).

Keep large (height) SMT components away from PTH areas.
Leave the leading and trailing areas around PTH components as clear as possible.
DON'T put any SMT components within 3mm (0.12") of any PTH components.
DON'T put all PTH components in line along one edge of a board - leave some space to allow us to support the masking in the centre of the board.