Wafer Auto Packaging Machine

Specifications

Wafer Auto Packaging Machine is suitable for packing biscuit on edge, cookies, wafer etc.

Wafer Auto Packaging Machine

 

Application:

A wide range of applications such as biscuits on edge, chocolates, soaps, snow biscuits and etc.

Features:

1. Save pallets, prevent pollution and lower cost.

2. Roll film, automatically filling, sealing, and cutting.

3. English-chinese touch screen.

4. Speed control via A.C. invertors.Film control via servo motor.

5. Photoelectric cell and dual tracking without mechanical contact.

 

Packaging film Roll Max Width: 450mm

Product Measurements: L: 80-240mm; W: 40-80mm; H: 40-70mm

Working Capacity: 30-70 bags/ minute

Dimensions of Machine: 5000 × 1105 × 1750mm

Types of film: PE/Paper, OPP/PE, AL/PE and ETC

Machine Weight Machine: 1300kg

Power Required: 220 V/AC- 1 phase- 50 Hz

Power Consumption: 4.5kw