Nanya Epoxy Resin 901 – Reliable Encapsulation & Potting Solution
Product Overview
Nanya Epoxy Resin 901 is a high-performance solid-state epoxy resin designed for demanding industrial applications. With exceptional bonding strength, high-temperature resistance, and chemical stability, it is widely used in electronic encapsulation, composite material bonding, anti-corrosion coatings, and more. It is the ideal choice for engineers and manufacturers.
Key Features
✅ Superior Bonding Performance
High-strength adhesion to metals, plastics, ceramics, and other materials
Low shrinkage, maintaining dimensional stability after curing.
✅ High Temperature & Chemical Resistance
Long-term operating temperature range: -50°C to +200°C (adjust based on actual data).
Resistant to acids, alkalis, solvents, and oils, suitable for chemical equipment protection.
✅ Versatile Applications
Electronics Industry: PCB encapsulation, chip bonding, insulating coatings.
Industrial Repair: Equipment crack filling, metal structure reinforcement.
Composite Materials: Carbon fiber/glass fiber laminate bonding.
✅ Eco-Friendly & Safe
Low VOC (Volatile Organic Compounds), compliant with RoHS/REACH standards (if applicable).
Non-toxic after curing, passes ISO 10993 biocompatibility testing (if used in medical fields).
Technical Specifications
| Parameter | Value |
|---|---|
| Appearance | Solid/Amber (as per actual) |
| Viscosity (25°C) | XX cP (for liquid type) |
| Curing Conditions | 24h at room temperature or heat-cured (e.g., 80°C/1h) |
| Hardness (Shore D) | ≥85 |
| Thermal Conductivity | 0.2 W/(m·K) (if applicable) |
Packaging & Storage
Available Sizes: 1kg, 5kg, 20kg containers.
Shelf Life: 12 months in original, unopened packaging at <25°C.
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