Home > Products > High temperature vacuum hot pressing bonding machine > 300 Degrees High Temperature Vacuum Hot Press High Temperature Experimental Machine for New Material Development
300 Degrees High Temperature Vacuum Hot Press High Temperature Experimental Machine for New Material Development
- shenzhen/guangzhou/YIWU
- T/T Other
- 15 days
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Product Description
Vacuum thermocompression bonder for Hard plastic chips(PMMA/PC) features:
(1) the use of constant temperature control heating technology, precise temperature control;
(2) aluminum work platform, the upper and lower surface formation, heat conduction speed, thermal conductivity are uniform;
(3) heating area, covering the commonly used size chip;
(4) air cooling, cooling rate uniform, help to improve the bonding effect;
(5) the pressure is precisely adjustable, different pressure control for different materials;
(6) a unique vacuum hot pressing system, the chip is not damaged in the case of greatly improve the bonding
Contact Us
- Shenzhen Hailunda Technology Co.,LTD
- Contact nameJoe Chat Now
- Phone86-13684976583
- AddressFloor 3, building 3, huixin intelligent industrial park, lianteng road, guangming new district, shenzhen, China, Shenzhen, Guangdong
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