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Home > Electrical & Electronics > Power Transmission & Transformer > Transformer > 300 Degrees High Temperature Vacuum Hot Press High Temperature Experimental Machine for New Material Development
300 Degrees High Temperature Vacuum Hot Press High Temperature Experimental Machine for New Material Development
US$ 23000 - 25000
MOQ: 1 Piece
Key Specifications
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Business Type:
Manufacturer
Year Established:
2010
Factory Size:
Below 1,000 square meters
Payment & Shipping
Payment Methods:
Port of Shipment:
shenzhen/guangzhou/YIWU
Delivery Detail:
15 days
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Vacuum thermocompression bonder for Hard plastic chips(PMMA/PC) features：
(1) the use of constant temperature control heating technology, precise temperature control;
(2) aluminum work platform, the upper and lower surface formation, heat conduction speed, thermal conductivity are uniform;
(3) heating area, covering the commonly used size chip;
(4) air cooling, cooling rate uniform, help to improve the bonding effect;
(5) the pressure is precisely adjustable, different pressure control for different materials;
(6) a unique vacuum hot pressing system, the chip is not damaged in the case of greatly improve the bonding
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Business Type
Manufacturer
Year Established
2010
Factory Size
Below 1,000 square meters
Annual Export Value
US$1 Million - US$1.5 Million
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