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Good Thermal Conductive Thermal Gap Pad With no Silicone Material for Monitoring the Power Box
US$ 0.5 - 18
MOQ: 100 Pieces
Key Specifications
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Brand Name:
ziitek
Place of Origin:
China
Model Number:
Z-Paster140-20-11UF
Payment & Shipping
Payment Methods:
Port of Shipment:
Dongguan
Delivery Detail:
3 days
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Brand Name
ziitek
Place of Origin
China
Model Number
Z-Paster140-20-11UF
Material
Other
Type
Insulation Film
Application
High Temperature
Rated Voltage
high voltage
Tensile Strength
good
Good thermal conductive thermal gap pad with no silicone material for monitoring the power box
Z-Paster 140-20-11UF Series is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.
It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features
Features
Silicone-free
ROSH compliance
Good thermal conductive:2.0 W/mK
UL recognized
Easy release construction
Application
mainboard/mother board
notebook
power supply
Heat pipe thermal solutions
Memory Modules
Mass storage devices
Contact us：
Mor information, please contact us: sales22@ziitek.com
Send Inquiry to This Supplier
Mrs. Miss. Sophia
sale Manager
Dongguan, Guangdong, China
* Email
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Business Type
Manufacturer
Year Established
2006
Factory Size
3,000-5,000 square meters
Total Employees
201 - 300 People
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