Qianli 4 IN 1 middle frame reballing platform

Qianli 4 IN 1 middle frame reballing platform for Phone 13/13 Pro/13 Pro Max/13 mini. Qianli Magnetic middle frame reballing platform 4 in 1 for Phone 13 series. Qianli Phone 13 series 4 in 1 double-sided middle layer reballing stencil platform regular/simple version for Phone 13 motherboard soldering repair. Qianli 4 in 1 motherboard tin planting platform for Phone 13-13 Pro Max. 

Features:

Multiple Models: Suitable for Phone 13/13Pro /13Pro Max /13Mini, innovative single-sided. 4 models universal to meet your maintenance needs.

Silicone non-slip foot pads, specific weighted iron plate at the bottom Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid and anti-scald, so that the tin planting position is more stable.

Stencils with no bulge under high temperature: 4 in 1 Middle frame reballing platform Precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge Phone 13/13Pro /13Pro Max /13Mini.

User's Guide Shows:

Step 1: Install the motherboard. Put the lower layer of motherboard that needs reballing to the corresponding positioning pins. Place it in the synthetic stone base.

Step 2: Install stencils

Align the stencils of the corresponding model with the positioning pins and put it into the base.

Step 3: Apply solder paste Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste.

Step 4: Heat evenly Combine the top cover of the product with the base and operate. Use the hot air gun to heat the corresponding reballing hole.