5-gallon PUR industrial dual color hot melt adhesive machine, dual pressure plate, porous material and plastic bonding

wooden case

Product characteristics

1. 485 bus control mode, touch screen operation, full Chinese interface

2. Provide programmable 2-point input and 2-point output wiring signals

3. Equipped with energy-saving standby function

4. Heater over temperature, sensor open circuit and other fault alarms, power outage protection function

5. Hot melt adhesive exhausted and bucket change warning function

6. When the hot melt adhesive is not melted, the motor is prohibited from starting the protection function (when the temperature of the heating pressure plate does not reach the set temperature, the motor cannot run, solving the problem of misoperation by operators)

7. The outer surface of the heating pressure plate is coated with Teflon coating, which can effectively prevent glue carbonization, prevent blockage of the glue conveying system, and facilitate cleaning;

8. Progressive heating and melting, with the heating pressure plate placed above the resin. When the pressure plate is heated, only the upper layer of the rubber barrel contacts the heating pressure plate, reaching the melting point and melting into liquid. The lower part of the rubber barrel does not melt at this time, and we can melt as much as we need during production;

9. There is a high-temperature sealing ring between the heating pressure plate and the inner wall of the rubber barrel, which ensures that the melted liquid resin will not come into contact with air, ensuring the use requirements of PUR hot melt adhesive characteristics;

10. Stepless adjustment of glue output, precise gear pump operation control motor adopts stepless frequency converter for speed regulation, which can effectively control the output;

Product Usage

PET transparent box, car interior parts, car lights, book and magazine binding, trolley trunk, household appliance assembly; Furniture edge banding machine, Velcro (adhesive buckle) shoe material leather bonding.