- Donghongxin
-
Shenzhen, Guangdong, China
- Main products: hardware, wafer cassette, wafer frame, slot magazine, ic tube
TSSOP Package Toasting Plating Vehicle
- shenzhen
- T/T
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Product Details
| Model Number | MDB61A02-000-R0 | Size | 243*79.6*349mm |
Product Description
The TSSOP package toasting electroplating carrier is a necessary carrier for the toasting and sealing process of the chip package lead frame. It is not only resistant to high temperature, but also has high precision to operate together with the equipment. It uses high-quality 304 stainless steel for precision laser cutting, bending and surface grinding. The product is safer and more durable to use. The etching number processing can quickly find the location where the product is stored, and facilitate the inventory to improve the production efficiency of the workshop.
Contact Us
- Donghongxin
- Contact namewei Chat Now
- Phone86-0755-29851938
- AddressBuilding 12, Wanfeng Dayangtian Industrial Zone, Baoan District, Shenzhen, Guangdong
Product Categories
| wafer cassettes | slot magazine | semiconductor equipment | wafer frame |
| IC tube | revolving storage product |
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