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Layers: 1 to 12 Layers
Base Materials: XPC FR1 FR2 CEM1 CEM3 , FR4, High TG FR4
Base Copper Thickness: 0.5 oz. to 3 oz.
BoardThickness: 0.4mm-3.2mm
Maximum Panel Size: 406mm x 610mm
Minimum Hole Diameter: 0.3mm
PTH Hole Tolerance: 0.05mm
Finish: OSP, Flux, Lead Free HASL, Plating Gold, Immersion Ni/Au
Immersion Tin, Carbon Through Hole, Silver Through Hole,
Minimum Line Width: 0.1mm
Minimum Line Spacing: 0.1mm
Mechanical Fabrication: Minimum Hole registration tolerance (NPTH): 0.076
Minimum Hole registration tolerance (PTH): 0.076mm
Minimum Pattern registration tolerance: 0.076mm
Minimum S/M registration tolerance (LPI): 0.076mm
Minimum Annular ring: 0.1mm( artwork)
Minimum S/M bridge (LPI): 0.076mm
Plated gold thickness: 0.01um ~0.025um
Immersion gold thickness: 0.025um -- 0.2um
Electrical Testing: Voltage: 24V - 300V
ontinuity:5 - 100Ohms
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