Solderable Polyester-imide Enamelled Round Copper Wire,Class 180,With A Bonding Layer
Dimension of copper wire
0.05-0.80mm
Heat shock of copper wire
The minimum heat shock temperature shall be 200.
Cut-through of copper wire
No failure shall occur within 2 minutes at 265.
Heat bonding of copper wire
When testing the specimens according to the test mathod.no turns other than possibly the first and the last shall be separated .
Breakdown voltage
The elevated temperature shall be 180.
Continuity of insulation of copper wire
The number of faults per 30 m of wire shall not exceed the values given in GB/T 6109.1-2008.
Solderability
The temperature of the solder bath shall be 470±5.The maximum immersion time shall be in accordance with the relevant specification sheet. The surface of the tinned wire shall be smooth and free of holes and enamel residue.
Temperature index
The temperature index shall not be less than 180 and the time to failure at the lowest test temperature shall not be less than 5000 h.
Standard in accordance with
Enterprise standard
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