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Green Solder Mask FR4 180 Tg Multi Layer PCB Boards ENIG for HDI and BGA

Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)

Key Specifications

Brand Name:

SYF

Place of Origin:

China

Model Number:

SYF-028

Shenzhen SYF Precision Electronics Limited.

Payment & Shipping

Payment Methods:

Port of Shipment:

China

Delivery Detail:

7 days

Brand Name SYF

Place of Origin China

Model Number SYF-028

Delivery Time:6-8 DAYS
Certification:UL,ISO9001:2008,ROHS,REACH,HALOGEN FREE,SGS

Green Solder Mask FR4 180 Tg Multi Layer PCB Boards ENIG for HDI and BGA

Characteristics:

1. Professional PCB manufacturer.

2. PCBA,OEM,ODM service are provided.

3. Gerber file needed.

4. Products are 100% E-tested.

5. Quality guarantee and professional after-sale service.

PRODUCT’S DETAILS
Raw Material	FR-4 (Tg 180 available)
Layer Count	8-Layer
Board Thickness	1.6mm
Copper Thickness	2.0oz
Surface Finish	ENIG(Electroless Nickel Immersion Gold)
Solder Mask	Green
Silkscreen	White
Min. Trace Width/Spacing	0.075/0.075mm
Min. Hole Size	0.25mm
Hole Wall Copper Thickness	≥20μm
Measurement	300×400mm
Packaging	Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps
Application	Communication,automobile,cell,computer,medical
Advantage	Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements	Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable
Certification	UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB
Process Engineering	Items	Manufacturing Capability
Laminate	Thickness	0.2～3.2mm
Production Type	Layer Count	2L-16L
Cut Lamination	Max. Working Panel size	1000×1200mm
Inner Layer	Internal Core Thickness	0.1～2.0mm
Internal width/spacing	Min: 4/4mil
Internal Copper Thickness	1.0~3.0oz
Dimension	Board Thickness Tolerance	±10%
Interlayer Alignment	±3mil
Drilling	Manufacture Panel Size	Max: 650×560mm
Drilling Diameter	≧0.25mm
Hole Diameter Tolerance	±0.05mm
Hole Position Tolerance	±0.076mm
Min.Annular Ring	0.05mm
PTH+Panel Plating	Hole Wall copper Thickness	≧20um
Uniformity	≧90%
Outer Layer	Track Width	Min: 0.08mm
Track Spacing	Min: 0.08mm
Pattern Plating	Finished Copper Thickness	1oz～3oz
EING/Flash Gold	Nickel Thickness	2.5um~5.0um
Gold Thickness	0.03~0.05um
Solder Mask	Thickness	15～35um