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Technical requirements:
layer: 8 layer
Thickness: 0.8mm
finish coatting: Immersion gold
copper size: 1 oz
Solder mask: green
Material: FR-4
Min.hole size: 0.1mm(4mil)
Min.line width/space: 0.1mm/0.1mm(4mil/4mil)
Special technique: Blind & buried via+Impedance control
HDI 8 layer pcb board
Reference - Our Production Capability for Rigid PCB:
1) Layer: 1-30
2) Board finished thickness: 0.21mm-7.0mm
3) Material: FR-4, CEM-1,CEM-3, High TG, FR4 Halogen Free,Rogers
4) Max. finished board size: 23 × 25 ( 580mm×900mm )
5) Min. drilled hole size: 3mil (0.075mm)
6) Min. Line width: 3mil (0.075mm)
Min.Line spacing:3mil (0.075mm)
7) Surface finish/treatment : HASL / HASL lead free,HAL, Chemical tin,Chemical Gold, Immersion Silver/Gold,OSP,Gold plating
8) Copper thickness: 0.5-7.0 OZ
9) Solder mask color: green/yellow/black/white/red/blue
10) Copper thickness in hole: >25.0 um (>1mil)
11)Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
12) Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
13) Certificate: UL, ISO 9001, ISO 14001,SGS , RoHS
14) Special requirements: Buried and blind vias+controlled impedance +BGA
15) Profiling: Punching, Routing, V-CUT, Beveling
16) Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products
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