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Products Introduction
Resin binder having a good self-sharpening, sharp cutting, high grinding efficiency, workpiece surface roughness is low, less heat, easy to burn the workpiece, suitable for most workpiece materials efficiency, precision grinding and polishing.
The main target: Industry for LED sapphire wafer, the silicon wafer, GaAs, GaN wafer, glass and other products processing industry.
Material of workpiece: synthetic sapphire, Monocrystalline silicon, gallium arsenide and gallium nitride and other materials
After years of practice and research, Juchuang Abrasive has has made a great success in resin bonded grinding wheel. Our rigorous process, product performance and stability. It is widely used in coarse grinding material, semi-fine grinding, grinding, polishing and cutting.
Juchuang Abrasive offers a variety of resin bonded grinding wheel,
Diameter range: φ6-900mm, wheel thickness: 0.5-400mm, grit size: 30/35-w0.5, offer the special wheels as customer’s requirements.
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