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Help CenterSamsung EXCEN New Generation - Small Footprint Chipshooter - 120k Cph
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World’s Highest Area Productivity
A high speed modular mounter using a high speed rotary head equipped with 16 nozzles. EXCEN has the world’s highest speed in the world among mounters of the same class as well as the world’s highest area productivity. In addition, it secures the reliability of fine chip placement by using the function to monitor pre- and post-part placement, SVS (Side-view Vision System), and maximizes work convenience and actual productivity by applying various operation modes including non-stop device type change,mixed production of different boards as well as the SMART Feeder that realizes the world’s first Auto Splicing and Auto Loading functions.
Features:
•120,000 CPH(Optimum)
•Ultra Slim Design with a Total Length of 1.25m
•High Speed Rotary Modular Head
•Side-view Vision System(SVS) - Monitoring of pre- and post-part placement
•Mixed Production of Different Boards
•Independent Production at the Front and Rear/
•Non-stop Change-over of Device Types
•High Speed and High Precision Feeder
•SMART Feeder - The world’s first Auto Splicing and Auto Loading functions
Placement Rate : 120'000cph(9850IPC)
Placement Accuracy: ±50µ@3σ/Chip
Component Range: 01005~8mm² by vision (Fixed Type Cameras)
Max Height = 3mm
PCB Size: 330mm x 250mm
PCB Thickness: 0.3 ~ 4mm
Feeder Capacity: 120 x 8mm by Docking Cart (30Each)
External Dimensions: 1250mm(L) x 2420mm(D) x 1430mm(H)
Options:
•Multi Function Head Option (76'000cph)
•01005~18mm², H=8mm
•IC/Connector Lead pitch @ 0.5mm
•BGA/CSP Ball pitch @ 0.3mm
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