Flexible Printed Circuit Boards With Polyimidehigh Tg Polyimide Ni / Au , Enig , Tin Plating Surface
Certification:UL,ROHS,ISO
Flexible Printed Circuit Boards With Polyimidehigh Tg Polyimide Ni / Au , Enig , Tin Plating Surface Treatment
Rigid-flex, flexible circuit 1-12 layers Width / space - 0,075mm single / double sided Hole (mini) - drill (pth) 0,15mm / punch 0,5mm Surface treatment - Ni / Au, ENIG, Tin plating Peel strenght - adhesive 1,0 mil - 1,0 kg f/cm IPC-TM 650 2.4.9- adhesive 0,5 mil - 0,5 kg f/cm IPC-TM 650 2.4.9
Solder float resistance - 270oC / 10 sec Insulation resistance - 500 Mohm Dielectric withstanding voltage - 500 V
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