Double Layer DIP SMT PCB Assembly FR4 , Leadless Chip Carriers / CSP

Welcome to Rigao Electronics .CO.,Ltd.

Single-side,double-sided and multilayer PCB and PCB Assembly manufacturer/OEM

- Contract Manufacturing

- Mixed-technology (High speed SMT & Through hole assembly)

- PCB Design & Assembly and copy service

- Prototyping

- Components purchasing

- Metal box,Coil,Cable and Wire Assemblies

- Plastics and Molds

PCB Assembly Technical Capability

We deliver high quality surface-mount technology (SMT) products through the use of modern, well maintained SMT lines that are operated by trained professionals. Our SMT lines are capable of handling both low and high volume through-put, can perform single and double sided component placement, mixture of SMT automatic and manual component assemblies, SMT and through-hole assemblies.

Capability   1.SMT with 4 million placements per day
                   2.Manual insertion with output 500,000pcs components per day
                   3.Chip mounting speed is 0.3S/unit,high-point speed is 0.16S/unit
                      

Mount Precision: 1.Chips size:Min.0201
                           2.Mounting precision:0.1mm
                           3.Multi-functional machine can match 0.3 pitch packages such as BGA,CSP

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