FR4 High TG + Kapton Prototype PCB / Rigid Flex PCb 14 Layer With Blind , Buried Vias
Certification:UL, ISO9001, TS16949
FR4 High TG + Kapton Prototype PCB / Rigid Flex PCb 14 Layer With Blind , Buried Vias
Specification:
|
Material |
FR4 High TG + Kapton |
|
Layer count |
14 layers |
|
Board thickness |
1.6mm |
|
Copper thickness |
Inner layer 0.5oz, out layer 1oz |
|
Minimum drill size |
0.1mm |
|
Minimum trace & gap |
0.075mm |
|
Surface finish |
Immersion gold |
|
Applications |
Industry Control Board |
|
Special Technology |
HDI board with laser drill |
|
Blind vias: 1-2, 2-3, 12-13,13-14, buried vias: 3-12 |
PCB Circuit Board
|
NO |
ITEM |
Technical capabilities |
|
1 |
Layers |
1-20 layers |
|
2 |
Max. Board size |
508×610 mm |
|
3 |
Min. board Thickness |
2-layer 0.12mm |
|
4-layer 0.4mm |
||
|
6-layer 0.6mm |
||
|
8-layer 0.90mm |
||
|
10-layer 1mm |
||
|
4 |
Min. line Width/Space |
0.127mm(4mil) |
|
5 |
Max. Copper thickness |
5OZ |
|
6 |
Min. S/M Pitch |
0.075mm(3mil) |
|
7 |
Min. hole size |
0.15mm(6mil) |
|
8 |
Hole dia. Tolerance (PTH) |
±0.05mm(2mil) |
|
9 |
Hole dia. Tolerance (NPTH) |
|
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