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Green Solder Mask 12 Layer Immersion Silver PCB FR4 High TG , HDI Board With Laser Drill

Green Solder Mask 12 Layer Immersion Silver PCB FR4 High TG , HDI Board With Laser Drill photo-1
Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)
Key Specifications
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Brand Name:
VIASION
Place of Origin:
China
Model Number:
VP101
Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
7 days
Brand Name VIASION
Place of Origin China
Model Number VP101
Delivery Time:2 week
Certification:UL, ISO9001, TS16949

Green Solder Mask 12 Layer Immersion Silver PCB FR4 High TG , HDI Board With Laser Drill

Specifications:

Material

FR4 High TG

Layer count

12 layers

Board thickness

1.6mm

Copper thickness

Inner layer 0.5oz, out layer 1oz 

Minimum drill size

0.1mm

Minimum trace & gap 

0.075mm

Surface finish 

Immersion silver

Applications

Communication  

Special Technology

HDI board with laser drill 

Blind vias: 1-2, 11-12, buried vias: 2-11

PCB Circuit Board

NO

ITEM

Technical capabilities

1

Layers

1-20 layers

2

Max. Board size

508×610 mm

3

Min. board Thickness

2-layer 0.12mm

4-layer 0.4mm

6-layer 0.6mm

8-layer 0.90mm

10-layer 1mm

4

Min. line Width/Space

0.127mm(4mil)

5

Max. Copper thickness

5OZ

6

Min. S/M Pitch

0.075mm(3mil)

7

Min. hole size

0.15mm(6mil)

8

Hole dia. Tolerance (PTH)

±0.05mm(2mil)

9

Hole dia. Tolerance (NPTH)

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Business Type
Trading Company
Total Employees
101 - 200 People
Main Markets
North America, South America, Eastern Europe
Location
Shaoxing, Zhejiang, China