High Density Interconnect FR4 , CEM-1 Multilayer PCB Prototype 10 - 28 Layer for Consumer Electronic

High density interconnect FR4 , CEM-1 Multilayer PCB prototype 10 - 28 layer for consumer electronics

Description

1. Professional manufacturer of PCB and PCB assembly, specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly.
2. Material Type: FR4,CEM-1, non-halogen material, Aluminium Base, Cooper Base, high frequency material ,Thick copper foil, 94-V0(HB), PI Material, High TG:SL S1000-2,ITEQ:IT180.
3. Surface treatment: HASL, HAL LF, Immersion Gold, Immersion Tin, Immersion silver, Gold Finger, OSP.

Application

Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries

Advantage

1. PCB from factory directly
2. PCB which have the comprehensive quality control system
3. PCB with good price
4. PCB with quick turn delivery time from 48hours.
5. PCB with certification (ISO/UL/RoHS)
6. PCB with 8 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB with high quality. strict test through AOI (Automated Optical Inspection),QA/QC, Flying Proble Test, E-test fixture