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Home > Computer Products > Keyboard > Mechanical Keyboard > Rigid Single Layer Printed Circuit Board Fabrication for Telecomunication CEM-3 FR-4

Rigid Single Layer Printed Circuit Board Fabrication for Telecomunication CEM-3 FR-4

Name: Rigid Single Layer Printed Circuit Board Fabrication for Telecomunication CEM-3 FR-4
Brand: Xinsheng
SKU: 147916010
Availability: InStock

Rigid Single Layer Printed Circuit Board Fabrication for Telecomunication CEM-3 FR-4 thumbnail-1

Rigid Single Layer Printed Circuit Board Fabrication for Telecomunication CEM-3 FR-4 photo-1

Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)

Key Specifications

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Brand Name:

Xinsheng

Place of Origin:

China

Model Number:

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Shenzhen Xinsheng Technology Co.,Ltd

Payment & Shipping

Payment Methods:

Port of Shipment:

China

Delivery Detail:

7 days

Product Details
Company Profile
Contact Us

Brand Name Xinsheng

Place of Origin China

Delivery Time:5-25days
Certification:CE、ROHS、 FCC,UL ,SGS

Rigid Single Layer Printed Circuit Board Fabrication for Telecomunication CEM-3 FR-4

Description:

Model Number	Rigid single layer printed circuit board
Number of Layers	Single sided board
Base Material	CEM-3 FR-4
Copper Thickness	1/2 oz min 4 oz max
Board Thickness	0.2mm-3.20m(8mil-126mil)
Min. Hole Size	0.20mm(10mil)
Min. Line Width	0.075mm(3mil)
Min. Line Spacing	0.075mm(3mil)
Surface Finishing	HASL, HAL Pb Free, HAL, Immersion Gold, Gold Plating, Immersion Tin
Brand
Color	Green, red, white, blue, yellow
Certifications	ISO 9001:2008,ISO 14001:2004, UL, SGS, CTI

Feature:

1. Our PCBs are used for wide range of electronic products
Like Medical devices, CCTV, Power supply, GPS, UPS, Set-top Box,Telecomunication ,LED, etc.
2. Provides OEM services to all sorts of printed circuit board assembly as well as Electronic encased products
3. Solder mask color: Green / Yellow / Black / White / Red / Blue.
4. Board material type: FR-4, Aluminium-backed board, Halogen-free, Lead-free compatible, High-Tg, High CTI, CEM-1, CEM-3, Rogers and more
5. Compound material lamination: 2 to 12 layers
6.Surface Finished type: HASL, Flash golds, ENIG,OSP(lead freecompatible), Carbon ink, Peelable S/M, HASL(lead free), Immersion silver/tin, Gold finger plating, ENIG+gold finger plating, Immersion Silver+gold finger plating