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Certification:ISO9001,ISO14001,GB/T28001
Black Curable Thermal - Conductive Flame - Retardant Hard Epoxy Resin With Low Adhesive
Description:
WEXP-85 is a double-component black curable thermal-conductive & flame-retardant Epoxy Encapsulating, with low adhesive and excellent flow and it can penetrate into the gap of products; it can be solidified through normal temperature or heating with suitable speed of solidification; there is no bubble with plain and glazing surface and high hardness; the solidified materials have an excellent performance of anti-alkaline, waterproof, oil- proof and dust-proof, which is humid and thermal resistant and air aging; it owns excellent electric and physical features of insulation, anti-pressing and high degree of adhesive.
Main Features:
1. Low Viscosity, Smooth Casting
2. Faster curing, filling port surface bright and clean.
3. Flammability Property and Electric Property are good
Specifications:
Using of Technology:
1. Curing Condition (Formula-1):
Normal Temperature 24Hours,Or 60°C/2Hours
2. Curing Condition (Formula-2):
80°C/2Hours + 100°C/2Hours+ 120°C/6Hours
Product Technical Specification:
|
Appearance |
- |
Black, White, Blue,Brown ,Silvery Grey, Options |
|
Viscosity(25°C) |
mPa.s |
8000-18000 |
|
Density(25°C) |
g/cm3 |
1.20-1.90 |
|
Curing time |
h |
<24 |
Performance after curing :
|
Item |
Formula 1 |
Formula 2 |
|
|
Volume Resistance |
Ω-cm |
>1014 |
>1014 |
|
Surface Resistivity |
Ω |
>1013 |
>1013 |
|
Martin Heat Resistance |
°C |
>75 |
>75 |
|
Electric Strength |
kV/mm |
>20 |
>20 |
|
Dielectric Constant |
- |
3-5 |
3-5 |
|
Dissipation Factor |
- |
<0.03 |
<0.03 |
|
Rockwell hardness |
- |
>75 |
>75 |
|
Impact Strength |
kJ/m2 |
>7 |
>7 |
|
Bending Strength |
MPa |
>80 |
>60 |
|
Absorption Capacity |
% |
<0.05 |
<0.05 |
|
Flame Resistance |
Level |
UL-94-V-O |
UL-94-V-O |
|
Oxygen Index |
- |
>30 |
>30 |
3. Formula 1:
WEXP-85: Hardener
Send Inquiry to This Supplier
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