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DEUTEQ CUBRITE 494
Acid Copper Strike
Introduction
1. Used in plating on plastics cycles following either electroless copper plate or properly conditioned electroless nickel plate.
2. Improve low current density coverage, increase throwing power, more uniform color and leveling from the following bright acid copper plate, and decreased tendency for "burn-off".
3. Used on any commercially plateable plastic substrate.
Operating Conditions
Copper Sulfate 67.5 to 90 g/L
Sulfuric Acid 112.5 to 225 g/L
Chloride Ion 30 to 100 mg/L
DEUTEQ CUBRITE 494 0.08 to 0.25%
Temperature 24 to 30°C
Cathode Current Density 0.8 to 1.5 ASD
Anode Current Density 1.4 to 3.0 ASD
Tank Voltage 1.0 to 3.0 Volts
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