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Noble Metal Initiator Prior to EN on Cu

Noble Metal Initiator Prior to EN on Cu photo-1
Negotiable MOQ: 1 Metric Ton (Price negotiable depending on order volume and customization)
Key Specifications
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Brand Name:
DEUTEQ
Place of Origin:
China
Model Number:
DEUTEQ ACTEQ 353
Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
7 days
Brand Name DEUTEQ
Place of Origin China
Model Number DEUTEQ ACTEQ 353

DEUTEQ ACTEQ 353
Noble Metal Initiator Prior to EN on Cu

Introduction

1.    An acidic initiator used on non-catalytic copper surfaces prior to processing in electroless nickel.

2.    Produces a thin metallic film on the surface of the copper which promotes the formation of a dense, adherent, fine-grained deposit in the subsequent electroless nickel plating solution.

 

Operating Conditions

DEUTEQ  ACTEQ 353       2 to 5% by volume

DI Water                                  92-95% by volume

Hydrochloric Acid 37%         3% by volume

Temperature                           25-32 °C
Time                                         1-5min

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Business Type
Trading Company
Total Employees
101 - 200 People
Main Markets
North America, South America, Eastern Europe
Location
Xi'an, Shaanxi, China