Noble Metal Initiator Prior to EN on Cu
DEUTEQ ACTEQ 353
Noble Metal Initiator Prior to EN on Cu
Introduction
1. An acidic initiator used on non-catalytic copper surfaces prior to processing in electroless nickel.
2. Produces a thin metallic film on the surface of the copper which promotes the formation of a dense, adherent, fine-grained deposit in the subsequent electroless nickel plating solution.
Operating Conditions
DEUTEQ ACTEQ 353 2 to 5% by volume
DI Water 92-95% by volume
Hydrochloric Acid 37% 3% by volume
Temperature 25-32 °C
Time 1-5min
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