Alumina Ceramic Substrate
alumina ceramic substrate
Alumina ceramic wafer ,alumina ceramic tile ,alumina ceramic sheet ,Ceramic substrate, alumina wafer
The high precision laser cutting processing installations can used for scribing,cutting and drilling ceramic substrates (Minimum hole diameter:0.2mm).Laser cutting method allows to produce ceramic substrates with various outside contour geometries,hole patterns,cut-outs and snap-lines.
Benefits:
·High cutting accuracy, very small tolerance.
·Eliminating the time-consuming and costly tool fabrication stage.
·As well as increasing the goods supply efficiency by a big margin and shortening the processing circle.
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