HDM-600 High Resolution Digital Microscope
Certification:CE
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Applications
1. Widely used for the inspection of micro-structure of large silicon chip 2. Analysis of bare IC structure and the inspection of defective sample 3. ITO clearance of LCD module and COG observation 4. Observation and analysis of metallographic structure 5. Micro-observation of reflective material 6. Optional motorized device with super depth of field can 3D display and measure the depth(More detail please contact our technician) |
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Basic Parameters
1.Magnification(17"display, 1/3"CCD):3X-600X 2.Minimum resolution:1um 3.Working distance:30mm 4.1X C-mout interface that is suitable for 1/3", 1/2", 1/3.2"CCD 5.Lens parfocalization 6.Central position remains unchanged 7.3W, DC12V large power LED light which brightness is adjustable 8.White track stand with coarse/fine tuning institutions which scale unit is 2um 9.VGA HD digital camera with resolution of 1280X1024 and high speed of 35fps which can connect to display directly |
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Options
1.High-rigidity stand with platform and coarse/fine tuning institutions which precision is 2um, High-precision rotary stage with scale, with option of XY manual movable stage
2.HDC300 HD USB micro digital camera with resolution of 2048×1536 and USB2.0 output, speed of 30fps and VMS3.5 dynamic measurement software(including a piece of optical calibration ruler) 3.High resolution camera: 5.0MP, 9.0MP with measurement process software
4.Four-in-one multi-functions camera: 10.0MP, VGA/SD card/USB2.0/100M Network Ports, 1.3MP dynamic output, speed of 30fps, 10.0MP static shooting, double cross line display(New product in development)
5.XY manual movable stage |
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Optical Parameters
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HDM-600 Lens
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N.A.
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0.025−0.118
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Res.(lp/mm)
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75−352
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MAG.
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1.05X−7.35X
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D.O.F.(mm)
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0.88−0.04
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W.D.(mm)
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30mm
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F.O.V.(mm)1/2"
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7.6-1.1
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