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Multi-layer PCB Specification providing OEM service to all sorts of printed circuit board assembly |
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1 |
Layer |
1-30 layer |
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2 |
Material |
FR-4, CEM-1, CEM-3, Hight TG, FR4 Halogen Free, FR-1, FR-2 |
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3 |
Board thickness |
0.2mm-3.5mm |
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4 |
Max.finished board side |
500mm*500mm |
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5 |
Min.drilled hole size |
0.25mm |
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6 |
Min.line width |
0.13mm |
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7 |
Min.line spaceing |
0.13mm |
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8 |
Surface finish/treatment |
HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating |
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9 |
Copper thickness |
0.5oz Min., 5.0oz Max |
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10 |
Solder mask color |
green/black/white/red/blue/yellow |
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11 |
Inner packing |
Vaccum packing, Plastic bag |
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12 |
Outer packing |
standard carton paking |
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13 |
Hole tolerance |
PTH:±0.076, NTPH:±0.05 |
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14 |
Certificate |
UL, ISO9001, ISO14001, ROHS, CQC, SGS |
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15 |
profiling punching |
Routing, V-CUT, Beveling |
*Application field :
Computer/TV/DVD/DVB/Telephone/Mobile Phone
Mobile Equipment/Telecom&Networking
Instrumentation and Automation
Industry Control Devices
Home Applicance
*Lead time:
Samples:2 layer pcb:4 to 5 days
4/6 layer pcb:5 to 7days
8 layer pcb:6 to 8 days
Mass produce:2 layer pcb:7 to 10 days
4/6 layer pcb:7 to15 days
8 layer pcb:8 to15 days
*Payment Turns
T/T, West Union, L/C, D/P, D/A Accepted
*produce capacity
250000 Squre meter per year
Send Inquiry to This Supplier
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