PCB Assembly
Laminate materials: FR-4, FR-1 and CME-1
Baseboard thickness: 0.3 to 4.0mm
Surface finish: OSP, HAL, immersion AU, silver/soft Au, Ni plating and gold finger
Twist: 0.5%
Insulation resistance: 10(11)
Test voltages: 150 to 300V
Finished board area: 560 x 610mm
Line width and spacing: 0.1mm (minimum)
Copper hole thickness: 25.0m
Pad diameter inner layer: 0.5mm (minimum)
Hole diameter: 0.25mm (minimum)
Hole tolerance:<ul>
PTH: 0.075mm
NPTH: 0.05mm
Hole location tolerance: 0.075mm
Profile tolerance CNC routing: 0.15</ul>
Solder mask bridge ability: 0.1mm
Solder mask rigidity: 6 hours
In-combustibility: 94V flammability</ul>
Packing:<ul>
Inner: vacuum/plastic
Outer: standard carton</ul>
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