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Help Center6 Layers Printed Circuit Board Assembly Manufacturing FR-4
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6 Layers Printed Circuit Board Assembly Manufacturing FR-4
Description
1. Single-sided, double side & multi-layer PCB with competitive price, good quality and excellent service.
2. FR-1, CEM-1, CEM-3, FR-4, FR-4 High TG, Aluminum base material.
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment.
4. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
5. Quantities range from prototype to medium batch production.
6.100% E-Test
Application
Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries
Advantage
1.PCB factory directly
2.PCB high quality
3.PCB good price
4.PCB quick time
5.PCB certification(ISO/UL/RoHS)...
Specification
|
SERIAL |
ITEM |
TECHNICAL DATA |
|
1 |
Layers |
2－16(layers) |
|
2 |
Max Board Size |
18" x 24" |
|
3 |
Max Board Thickness |
6mm |
|
4 |
Min Line Width |
4mil |
|
5 |
Min Line Space |
4mil |
|
6 |
Min Hole Size |
12mil |
|
7 |
PTH Wall Thickness |
1mil |
|
8 |
PTH dia tolerance |
±3mil |
|
9 |
NPTH hole dia tolerance |
±2mil |
|
10 |
Hole Position Deviation |
±2mil |
|
11 |
Outline Tolerance |
±6mil |
|
12 |
S/M Pitch |
3mil |
|
13 |
Insulation Resistance |
1E+12Ω(Normal) |
|
14 |
Thermal Shock |
288 ℃(3x10Sec) |
|
15 |
Warp and Twist |
≤0.7% |
|
16 |
Electric Strength |
＞1.3KV/mm |
|
17 |
Peel Strength |
1.4N/mm |
|
18 |
Solder Mask Abrasion |
≥6H |
|
19 |
Flammability |
94V-0 |
|
20 |
Electrical test |
10V -250V |
|
Material |
Surface Finish |
|
CEM-1 |
OSP |
|
FR-4 |
HASL |
|
FR-4 High TG |
HASL lead free |
|
Aluminum PCB |
Immersion/Chemical Gold |
|
FR406 |
Send Inquiry to This Supplier
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