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Help CenterENIG 1-layer Fpc Flexible Printed Circuit
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PCB Process Capability
· Finished thickness (thinnest - the thickest): 0.008 "~ 0.24" (0.20mm ~ 6.0mm)
· Minimum line width / spacing :3-4 mil (0.076-0.10mm)
· Impedance Control: ± 10%
· Base materials: FR4 ( ShengYi, KB, International), high TG (TG150, TG170), halogen-free board (Halogen-free), high frequency plate (Rogers, Teflon, Taconic), made PTFE (PTFE) ,, AL aluminum plate (Berquist, Al-made basis), copper (Cu Base), Iron (Fe Base), ceramic substrate (Ceramic Base)
FPC Process Capability
· Finished thickness (thinnest): 3mil (0.08mm)
· Minimum line width / spacing: 2 mil (0.05mm)
· Surface Treatment: OSP, HASL, Electric Nickel / Gold, , Chemical nickel / gold, lead-free HASL, Immersion Gold
· Thermal shock resistance: 260 °C 10 sec.
· <span style="" font-size:"="">Processing materials: polyimide (PI), polyester (PET), polyimide (PI) + FR4
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