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Negotiable
MOQ: 1 Piece (Price negotiable depending on order volume and customization)
Key Specifications
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Business Type:
Trading Company
Year Established:
1987
Total Employees:
101 - 200 People
Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
7 days
Related Products
Model No.:
Product Origin:China
Brand Name:
Price Terms:FOB Shanghai
Payment Terms:T/T, L/C at sight
Certification:UL
Description:PCB specifications: 1) The materials of copperplate: FR4 CEM-3 94V-0 GE IML 2) Max. spelling board size: 457 x 762mm, large board size possible upon requests 3) Layers single double 4-16 layers 4) Board thickness: 0.2-2.5mm 5) The smallest aperture: 0.2mm 6) The smallest width of line: 0.10mm 7) The smallest distance of line: 0.10mm 8) The smallest SMT jointing plate: 0.3mm 9) Warp permitting value of board surface: +-0.7% 10) The smallest bridge of hinder jointing: 0.10mm 11) Surface craft: HAL flash gold OSP cold contacts immersion gold 12) Special craft: blue or yellow character open hole or taphole 13) Hinder jointing: liquid sensitization glue 14) Skewer head gilt: nickel 5um; gold 0.75um 15) Figuration making: Numerical control mill/opened V trough/rush and cut 16) Solder mask: PSR4000, PSR2200 17) Profile: routing, punching, scoring 18) Inspection: 100% E-test 100% visual inspection, AOI for inner-trace FPC specifications: 1) Film thickness: PI 25 35 50 75 100um 2) PET: 12.5 25 35 50 75um 3) The thickness of copper: 18 35 50 70 100um 4) The smallest width of line: 0.08mm 5) The smallest distance of line: 008mm 6) The smallest aperture: 0.25mm 7) Max. size: 900 x 600mm 8) Layers and structure: single double 4 layers rigid-flex mix. board 9) Peel strength soldering:>0.7N/mm 10) Soldering: PI 260 degree of Celsius 6s; PET 135 degree of Celsius 5s 11) Flexural resistance: R=7, load 100g > 104 12) Insulation resistance:>100MΩ (500V) 13) Surface craft: gold sin/lead OSP
Product Origin:China
Brand Name:
Price Terms:FOB Shanghai
Payment Terms:T/T, L/C at sight
Certification:UL
Description:PCB specifications: 1) The materials of copperplate: FR4 CEM-3 94V-0 GE IML 2) Max. spelling board size: 457 x 762mm, large board size possible upon requests 3) Layers single double 4-16 layers 4) Board thickness: 0.2-2.5mm 5) The smallest aperture: 0.2mm 6) The smallest width of line: 0.10mm 7) The smallest distance of line: 0.10mm 8) The smallest SMT jointing plate: 0.3mm 9) Warp permitting value of board surface: +-0.7% 10) The smallest bridge of hinder jointing: 0.10mm 11) Surface craft: HAL flash gold OSP cold contacts immersion gold 12) Special craft: blue or yellow character open hole or taphole 13) Hinder jointing: liquid sensitization glue 14) Skewer head gilt: nickel 5um; gold 0.75um 15) Figuration making: Numerical control mill/opened V trough/rush and cut 16) Solder mask: PSR4000, PSR2200 17) Profile: routing, punching, scoring 18) Inspection: 100% E-test 100% visual inspection, AOI for inner-trace FPC specifications: 1) Film thickness: PI 25 35 50 75 100um 2) PET: 12.5 25 35 50 75um 3) The thickness of copper: 18 35 50 70 100um 4) The smallest width of line: 0.08mm 5) The smallest distance of line: 008mm 6) The smallest aperture: 0.25mm 7) Max. size: 900 x 600mm 8) Layers and structure: single double 4 layers rigid-flex mix. board 9) Peel strength soldering:>0.7N/mm 10) Soldering: PI 260 degree of Celsius 6s; PET 135 degree of Celsius 5s 11) Flexural resistance: R=7, load 100g > 104 12) Insulation resistance:>100MΩ (500V) 13) Surface craft: gold sin/lead OSP
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Business Type
Trading Company
Year Established
1987
Total Employees
101 - 200 People
Main Markets
North America, South America, Eastern Europe
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