VTC-600-2HD DC/RF Dual-Head High Vacuum 2" Magnetron Plasma Sputtering Coater

• 220VAC 50/60Hz, single phase

• 2000W  (including pump)

• DC source: 500W for coating metallic materials ( below left)

• RF source: 600W with automatching for coating non-metallic materials ( Center)

• Compact 300 RF source is available at extra cost ( Below right)

Magnetron Sputtering  Head

• Two 2" Magnetron Sputtering  Heads with water cooling jackets are included ( click picture-left to see detailed specs )

• One is connected to RF power supply for no-conductive materials

• Another is connected to DC sputtering power source for coating metallic materials

• Target size requirement: 2" diameter

• 1/16" max. thickness for metallic targets

• 1/4" max. thickness for no-conductive targets

• One stainless steel and one Al2O3 ceramic targets are included for demo testing

• Head Water Cooling: 10ml/min water flow required, and one 16ml/min digitally controlled recirculating water chiller is included for cooling both magnetron sputtering heads

• Customized coater:  two RF head without DC sputering, 3 RF head are available upon request

Vacuum Chamber

• Vacuum Chamber: 300 mm Dia x 300 mm height, made of stainless steel

• Observation Window:  100 mm diameter

• Hinged type cover on top with air spring sport makes target exchange easy

Sample Holder

• Sample holder size: 140mm dia. for. 4" wafer max

• Sample holder rotation speed is adjustable: 1 - 20 rpm for uniform coating

• The holder temperature is adjustable from RT to 500°C Max with accuracy +/- 1.0 °C

Gas Flow Control

• Two precision digital MFC (mass flow controller) are installed to allow two types of gases to be filled in

• Flow rate:  200 ml/min max.

• Flow rate is adjustable on the 6" touch screen control panel
  

• High speed turbo vacuum pump system (made in Germany) is directly installed on the vacuum chamber for max. vacuum level

• Heavy duty dual stage mechanical pump is connected to turbo pump for faster pump speed

• Mobile pump station is included and the compact sputtering coater can be put on top of station

• Max. vacuum level: 10^-6 torr with chamber baking

• One Precision quartz thickness sensor is built into the chamber to monitor coating thickness with accuracy 0.10 Å  

• LED Display Unit outside chamber can:

• Input material to be coated according to data base included

• Display total thickness coated and coating speed

• 5 pcs quartz sensors (consumable) are included 
  

• Water cooling is required

Overall Dimensions

L1300mm× W660mm× H1200mm

Net Weight

160 kg

Warranty

Operation Instruction

Application Note

• In order to remove oxygen from the chamber,  suggest you use 5% Hytrogen + 95 % Nitrogen to clan chamber 2-3 times, which can reduce oxygen to below 10 ppm

• Please use > 5N purity Argon gas for plasma sputtering.  Even though 5N purity Ar, usually contain 10- 100 ppm oxygen and H2O dependedon  supplier.  Strongly suggest you use gas purification device listed below to purify gas before filling in:  ( click pic to order )

• MTI supply single crystal substrate from A to Z ( click picture below-right to order )