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EDNSE LGA1366 1U-1366A 1U CPU Heat Sink
Negotiable
MOQ: 200 Pieces (Price negotiable depending on order volume and customization)
Key Specifications
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Application:
Other, CPU
Type:
Heatsink
Heatsink Material:
Copper
Payment & Shipping
Payment Methods:
Port of Shipment:
FOB SHENZHEN
Delivery Detail:
Delivery time depends on order quantity.
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Application
Other, CPU
Type
Heatsink
Heatsink Material
Copper
Brand Name
EDNSE
Model Number
1U-1366A
Place of Origin
Guangdong, China
| Model No | 1U-1366A |
| Application System | 1U+ Form Factor Active Solution |
| CPU Type | Intel® Nehalem |
| Socket Type | LGA1366 |
| Heat Sink | Copper Bade+Copper Skived Fin |
| Cooler Dimension | 89 x 89x 29 mm |
| Fastener | Screw + Spring |
| Interface Material | Shin Etsu X23-7783 |
| Fan Dimension | 75x75x15 |
| Fan Speed | 5000rpm |
| Fan Airflow | 10.75CFM |
| Fan Bearing Type | Dual Ball Bearing |
| Voltage Raring | 12v |
| Noise Level | 13.8 ~ 49dBA |
| Connector | 4 pins with PWM function |
| Mass | 400g |
| Back Plate | No |
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Business Type
Manufacturer, Trading Company
Year Established
2012
Factory Size
1,000-3,000 square meters
Total Employees
11 - 50 People
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