Hot Melt Glue for Electronic Label
Hot melt glue for electronic labels
This style is a pressure sensitive hot melt glue for electronic labels. With balanced performance in tack, holding power and peel strength, it can bond many kinds of substrates such as plastics, paper, metal, cloth and so on.
| Composition | Thermoplastic rubber and synthetic resins |
| Toxicity | None |
| Brookfield viscosity | 175°C-------5600 Cps |
| Ring and Ball softening point | 96 ºC |
| Rolling ball tack | > 28# |
| Holding power (1000 g, 1 inch2, 23ºC): | >24Hr |
| 180°peel strength to steel | > 24 N/inch |
| Recommended application temperature | 150~180 ºC |
| Shelf Life | 1Year in dry and cool environment |
| Packaging | 25 Kgs /box, cakes wrapped with release paper |
The largest manufacturer of HMPSA in China
Cooperating partner: UPM(the global label company)
Produce Process of Jaour Adhesive
PACKAGE
MAX QT'Y FOR 20' CONTAINER IS 19.2TONS WITH 10 PALLETS
or 21.5 tons without pallets
Jaour Adhesive Certification.
Certification:
Jaour Hot Melt Testing Report .
Testing Report:
Send Inquiry to This Supplier
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