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Home > Electrical & Electronics > Circuit Board > Multilayer PCB > High Quality Top 10 Hi-Fi Amplifier PCB Assembly

High Quality Top 10 Hi-Fi Amplifier PCB Assembly

US$ 100 - 300 MOQ: 50 Pieces

Key Specifications

Get Latest Price

Place of Origin:

Taiwan, China

Brand Name:

OEM

Number of Layers:

12-Layer

Contact Supplier Request Quote Chat Now

Might Electronic Co., Ltd.

Payment & Shipping

Payment Methods:

Port of Shipment:

Taiwan / Hong Kong

Delivery Detail:

Delivery time depends on order quantity.

Product Details
Company Profile
Contact Us

Place of Origin Taiwan, China

Brand Name OEM

Number of Layers 12-Layer

Base Material FR4, CEM-3, CEM-1

Copper Thickness 1 oz, 2 oz, 3 oz, 4 oz

Board Thickness 0.3mm ~ 3.2mm

Min. Hole Size Machine Drilling 0.2mm (8mil); Laser Drilling 0.1mm (4mil)

Min. Line Width 0.1mm (4mil)

Surface Finishing HASL, Gold Plating, ENTEK (OSP), Immersion Ag, Immersion Sn, Immersion

Product Description

Might has capability to handle range from prototype, High-Mix Low Volume to High Volume Low Cost for Amplifier PCB Assembly (Hi-Fi Electronic) at three manufacturing sites of Taiwan and China.

Our Services

Might integrates quality ISO & TS16949 certified systems and innovative PCB assembly technologies to deliver market-leading consumer electronic products, from product assembly through enclosures to testing and packaging. Might SMT & Thru-hole lines utilize the most advanced technologies in the industry.

Company Information

With over 25 years experience in this field, we are pround to cooperate with many well-know companies, such as Acer, D-Link, Gemalto, Hitachi, Honeywell and Pioneer.

FAQ

Might has capability to handle range from prototype, High-Mix Low Volume to High Volume Low Cost for Amplifier PCB Assembly (Hi-Fi Electronic) at three manufacturing sites of Taiwan and China.

Might integrates quality ISO & TS16949 certified systems and innovative PCB assembly technologies to deliver market-leading consumer electronic products, from product assembly through enclosures to testing and packaging. Might SMT & Thru-hole lines utilize the most advanced technologies in the industry.

SMD package, Chip-on-board and Flip Chip assembly technique
0201 chip, Micro BGA, u-BGA, QFN and LGA assembly
AI and Thru-hole assembly
RoHS, REACH compliance and Lead-Free solder technology
Chip Programming
Conformal Coating
ICT test and AOI inspection
ESD Protection Control Procedure
IPC-A-610E Class II and Class III Workmanship Standard

With over 25 years experience in this field, we are pround to cooperate with many well-know companies, such as Acer, D-Link, Gemalto, Hitachi, Honeywell, Naim Audio and Pioneer.

- Factory Preview -

- Our Products Application -

- Our Certificates - ISO9001 / ISO14001 / TS16949 / UL / TUV / CE / 3C

Please visit our website for more details: .tw