Layer count: 1-18 layer
Material: FR4, High Tg FR4
Material Mixed Laminate: 4 layer - 8 layer
Maximum Size: 610mm*720mm
Board outline Tolerance: ±0.13mm
Board thickness: 0.4mm-3.2mm
Insulation Layer Thickness; 0.10mm-6.0mm
Minimum line: 0.10mm
Minimum space: 0.10mm
Out layer copper Thickness: 17um-140um
Inner Layer copper Thickness: 17um-105um
Drilling Hole (Mechanical) : 0.30mm-6.35mm
Finish Hole(Mechanical) : 0.20mm- 6.30mm
Diameter Tolerance(Mechanical) : 0.05mm
Registration(Mechanical) : 0.075mm
Laser Hole: 0.10mm(out source)
Aspect Ratio: 10:0.1
Solder mask type: LPI, UV cure
SMT mini, Solder mask width: 0.10mm
Mini. Solder mask clearance: 0.05mm
Plug Hole Diameter: 0.25mm-0.60mm
Impedance control Tolerance: ±10%
Surface finish : HASL, HASL Lead free, Immersion Gold, OSP, Peelable mask, Gold finger,
Electrolytic Gold, Immersion tin, Immersion Silver, Carbon Ink
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