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SN60PB40 LEAD SOLDER BAR
Tin Lead Solder Bar---- Lead solder bar
1. Composition: Tin and Lead
2. Dimension:28.5cm * 1.8cm * 1.3cm, around 500grams/pc.
3. Melting temperture and Working temperature
| Alloy Composition(wt%) | Melting Temperature ℃ | Working Temperature ℃ | Working Method | |
| Sn63/Pb37 | 183 | 245-255 | Wave Soldering | |
| Sn60/Pb40 | 183~190 | 250-260 | Hot-Dip Soldering | |
| Sn55/Pb45 | 183~203 | 255-270 | Hot-Dip Soldering | |
| Sn50/Pb50 | 183~216 | 260-275 | Hot-Dip Soldering | |
| Sn45/Pb55 | 183~227 | 270-300 | Hot-Dip Soldering | |
| Sn40/Pb60 | 183~238 | 280-310 | Hot-Dip Soldering | |
| Sn35/Pb65 | 183~247 | 290-330 | Hot-Dip Soldering | |
| Sn30/Pb70 | 183~255 | 295-335 | Hot-Dip Soldering | |
| Sn25/Pb75 | 183~266 | 300-350 | Hot-Dip Soldering | |
| Sn20/Pb80 | 183~280 | above 350 | Hot-Dip Soldering | |
4. Application:
Sn63 and Sn60 solder bars are general used in Lighting, Electronic components, LED, Precise instruments, PCB, Audio and sound system and so on.Good performance in wave soldering and hot-dip soldering.
Sn55 and Sn50 solder bars are general used in Mechanical,Toys,Electrical,Socket and so on.Good performance in hot-dip soldering.
Sn45,Sn40,Sn35,Sn30,Sn25 and Sn20 solder bars are general used in Automobile parts, Radiators, Fuse,Lamp holder,Battery and other general soldering.
5. Features: a) Bright and Stable spot.
b) No corrosion and high insulation resistance.
c) Little residues, Good wettability and excellent oxidation resistance.
d) Quick melting speed and good fluidity.
6. Specification ---- Lead solder bar
| Item | Lead solder bar HW0289 | |||||||
| Flux content(%) | - | |||||||
| Specific gravity | 8.6 | |||||||
| Melting point | 183-190℃ | |||||||
| Usage | Suitable for use with standard wave soldering/solder posts | |||||||
| Storage information and warrantee period | Store in a cool, dry, non-corrosive environment. Product warrantee period of 1 years | |||||||
| Chemical composition of solder alloy | ||||||||
| Metal element | Sn | Pb | ||||||
| Composition(%) | Balanced | 40.3 | ||||||
| Maximum threshold of impurities in solder alloy | ||||||||
| Metal element | Bi | Zn | Fe | Al | As | Cd | Cu | Sb |
| Composition(%) | 0.027 | 0.002 | 0.007 | 0.007 | 0.03 | 0.002 | 0.04 | 0.12 |
Notes: This product and all components are compliant with GB/T 3131-2001 | ||||||||
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